Master Bond EP4S-80 is a one component, silver filled epoxy that cures at the low temperature of 80˚C. This non-premixed and frozen system has an unlimited working life and features a low viscosity for advanced bonding, sealing and gap filling applications.

Its smooth flowable consistency and volume resistivity of 0.02-0.06 ohm-cm makes it ideal for static dissipation in EMI/RFI shielding applications as well as for specialty encapsulations where electrical conductivity is desirable. Here it is seen being brushed on as a coating material showing ease of brushability.

EP4S-80 has a simple cure schedule of 60 to 90 minutes at 80˚C and offers wide temperature serviceability from -60˚C to +160˚C. This system features both high compressive strength as well as a high tensile modulus and bonds well to metals, ceramics, composites and many plastics.