TE Connectivity AMP is one of two Intel-qualified suppliers offering these first-generation cable assemblies (Intel OPA 100 Series) and they are also are a development partner for future generation cable assembly designs with Intel. In addition to these cable assemblies, TE offers the compatible LGA 3647 sockets and hardware required for OPA.

Features and Benefits

• Required for the latest Intel CPU processor design, Intel Omni-Path Architecture, by mating directly with LGA 3647 sockets at the processor and IFT connectors at the faceplate
• Meet high speed demands with 25 Gbps speeds
• Reduce system design costs by eliminating the need for costlier lower-loss PCB materials, such as retimers
• Improve loss characteristics and simplify system design by reducing the complexity of PCB laminates and routing
• Available in standard lengths and breakout configurations
• Customize for specific applications by pairing with other products such as Sliver connectors or STRADA Whisper connectors on the board or faceplate

	Image	Manufacturer Part Number	Description	Length		View Details
		2821723-4	IFP/LEC CBL ASSY 1 PORT TYPE B L	0.47' (142.0mm)
		2821778-1	IFP/LEC CBL ASSY 1 PORT TYPE B R	0.47' (142.0mm)
		2821721-1	IFP/LEC CBL ASSY 1 PORT TYPE B S	0.49' (150.0mm)
		2821722-1	IFP/LEC CBL ASSY 1 PORT TYPE B S	0.52' (160.0mm)
		2821724-1	IFP/LEC CBL ASSY 1 PORT TYPE B L	0.58' (178.0mm)
		2821722-2	IFP/LEC CBL ASSY 1 PORT TYPE B S	0.67' (203.2mm)
		2821722-3	IFP/LEC CBL ASSY 1 PORT TYPE B S	0.79' (242.0mm)
		2821724-3	IFP/LEC CBL ASSY 1 PORT TYPE B L	1.04' (318.0mm)
		2821723-1	IFP/LEC CBL ASSY 1 PORT TYPE B L	1.10' (335.0mm)
		2821723-2	IFP/LEC CBL ASSY 1 PORT TYPE B L	1.22' (371.0mm)