EN
TDK announces new 3-axis accelerometer, finalizing transition of SmartAutomotive™ non-safety product family to 105°C
  • New: 3-axis MotionTracking™ accelerometer for non-safety automotive applications
  • Automotive qualified up to 105°C ​​​​based on AEC-Q100 grade 2
  • Includes two independent interrupt lines and extended FIFO for reduced power consumption
  • Pin-to-pin and register compatible across TDK’s full line of inertial sensors

TDK Corporation  announced the InvenSense SmartAutomotive™ IAM-20381HT high-temperature monolithic 3-axis MotionTracking accelerometer for non-safety automotive applications, such as navigation, infotainment systems, telematics, and more. The launch represents a full transition of the InvenSense SmartAutomotive non-safety product line to 105°C.

The IAM-20381HT is part of a fully-compatible, multi-axis, multi-grade portfolio of SmartAutomotive products. With this release, TDK confirms its leadership in driving the inertial sensors market for both safety and non-safety automotive applications. The IAM-20381HT will be available at distributors worldwide by February 1, 2024.

“With this launch, TDK completes the transition from temperature grade 3 to grade 2 of the entire SmartAutomotive non-safety product line,” said Alberto Marinoni, Senior Director Product Marketing Automotive at InvenSense, a TDK Group company. “Now TDK provides a complete lineup of pin-to-pin and register-compatible inertial sensors for automotive while ensuring scalability of customer applications up to 105°C.”

The new stand-alone 3-axis MEMS accelerometer is offered in a thin 3 x 3 x 0.75 mm (16-pin LGA) package and is automotive-qualified based on AEC-Q100 Grade 2. The IAM-20381HT also features two programmable independent interrupt lines, wake-on-motion functionality, and a FIFO up to 4096-bytes, which can lower the traffic on the serial bus interface and reduce power consumption by allowing the system processor to burst-read sensor data and then go into a low-power mode. Such features enable a variety of motion-activated functions such as anti-theft, vehicle security, and driving style data recording.

TDK will demonstrate this and other technologies at the Consumer Electronics Show (CES) from January 9-12, 2024, in Las Vegas. Find TDK in the CES Central Hall (LVCC) at booth ​#​20521.

For additional information and collateral, please visit invensense.tdk.com/smartautomotive or contact InvenSense Sales at sales.us@tdk.com.


Glossary
  • IMU: Inertial Measurement Unit
  • 6-axis: 3-axis Gyroscope + 3-axis Accelerometer
  • 3-axis: 3-axis Gyroscope or 3-axis Accelerometer
  • MEMS: Micro-Electro-Mechanical Systems
  • DK: Developer kit
  • EV: Evaluation board
  • LGA: Land Grid Array
  • FIFO: First in First out
Main applications
  • Lift Gate Motion Detection
  • Tilt Measurement
  • Infotainment and Navigation Systems
  • Car Alarm
  • Telematics
  • Insurance Vehicle Tracking
  • Drive Style Recording
Main features and benefits
  • Automotive-qualified based on AEC Q100 Grade 2 qualification test methods
  • Thin 3 x 3 x 0.75 mm (16-pin LGA) package
  • 16-bit digital-output accelerometer
  • Accelerometer: X-, Y-, and Z-axes acceleration sensors with a user-programmable full-scale range up to ±16 g
  • User-programmable digital filters for accelerometer and temperature sensor
  • Embedded self-test
  • Two embedded configurable interrupt lines
  • Wake-on-motion functional
  • Final test over temperature
  • Pin-to-pin and register-compatible across with IAM-20680HT, IAM-20680HP, IAM-20380HT, IAM-20381
  • EV_IAM-20381HT evaluation board compatible with DK-Universal-I
/ 2024011002 / Electronic-components / TDK Corporation / Thursday 11. January 2024 / ---

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