Parker Chomerics' T777 thermally enhanced and inherently tacky phase change material
Parker Chomerics' THERMFLOW T777 is a thermally enhanced and inherently tacky phase change material designed to completely fill interfacial air gaps and voids within electronics assemblies. It is classified as polymer solder hybrid material (PSH).
The ability to completely fill air gaps and voids typical of component packages and heat sinks allows THERMFLOW pads to achieve performance superior to any other thermal interface materials.
At room temperature, THERMFLOW materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface. THERMFLOW material softens as it reaches component operating temperatures. With light clamping pressure, it will readily conform to both mating surfaces. Upon reaching the required melt temperature, the pad will fully change phase and attain minimum bond-line thickness (MBLT) of less than 0.001 inch or 0.0254 mm and maximum surface wetting. This results in practically no thermal contact resistance due to a very small thermal resistance path.
Features
- Low thermal impedance
- Can be pre-applied to heat sinks
- Demonstrated reliability through thermal cycling and accelerated age testing
- RoHS compliant
- Protective release liners prevent contamination
- Available in custom die-cut shapes and kiss-cut on rolls
Applications
- Chipsets
- Microprocessors
- Graphics processors
- Power modules
- Memory modules
- Power semiconductors
- Superior thermal performance
- Ideal solution for mobile microprocessors
- Resin system designed for higher temperature reliability
- Dispersed solder filler offers added thermal performance
- UL 94 V-0 flammability rated
- Tabs available for easy removal
- Inherently tacky, no adhesive required
THERMFLOW® T777 Phase Change Material